March 31, 2020

Test And Burn-in Sockets Market will be Growing at a CAGR of 5.6% during the forecast period from 2019 to 2027

According to a new market research report published by Credence Research “Test and burn-in Sockets Market– Growth, Future Prospects and Competitive Analysis, 2019 – 2027”, the global test and burn-in market for sockets is set to grow with a CAGR of 5.6 percent over the forecast period.

Market Insights

Growing demand for consumer electronics and automotive is driving growth in the market for test and burn-in sockets. These sockets provide a semi-permanent connection between the device and the board, thereby exposing the electrical device to an elevated temperature. Test and burn-in sockets involve the process by which components of the system are used before they are put into service. These sockets are used to detect components on a PCB board that may fail due to an initial high load. As a result of these factors, we expect the test and burn-in market to grow rapidly throughout the forecast period from 2019 to 2027.

Browse Full Report Originally Published by Credence Research at https://www.credenceresearch.com/report/test-and-burn-in-sockets-market

On the basis of the application, CPU & SPU have the largest share of test revenue and burn-in socket market. Test and burn-in sockets enable high speed and high density even in low voltages and therefore have a high demand in the CPU & SPU segment. The CMOS image sensor segment is the fastest growing segment and is expected to grow at an annual growth rate of over 8.7% over the forecast period. The increased adoption of these sensors in AR / VR technologies is driving the growth of the market for test and burn-in sockets. Backed by increased demand from tablets, smartphones, DSLR cameras, the sale of CMOS image sensors is on the rise. For these reasons, the CMOS image sensor segment is the fastest growing segment on the market for test and burn-in sockets.

Based on geography, North America has the highest market share of test and burn-in sockets. North America has the highest share due to huge investments in technological advances and increasing demand for connectors, driving support systems in the region. Asia Pacific will be the second largest test and burn-in socket region due to high demand for the same in India and China. Increased sales in consumer electronics and growth in the automotive industry in the emerging economies of the Asia-Pacific region are increasing demand for the test and burn-in socket market. As a result, Asia Pacific will be the fastest growing region in the forecast period.

Some of the major companies profiled in the report include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconect, LEENO, Sensata Technologies, Johnstech, Yokowo, WinWay Technologies, Loranger and others.

Access Free Sample Copy of Research Report: https://www.credenceresearch.com/sample-request/59963

[Note: Our Free Complimentary Sample Report Accommodate a Brief Introduction To The Synopsis, TOC, List of Tables and Figures, Competitive Landscape and Geographic Segmentation, Innovation and Future Developments Based on Research Methodology are also Included]

Report Scope by Segments

By Product Type

 • Burn-in

 • Test

By Application Type

 • Memory

 • CMOS image sensor

 • High Voltage

 • RF

 • CPU & SPU

By Geography Segment

  • North America (U.S., Rest of North America)
  • Europe (U.K., Germany, France, Rest of Europe)
  • Asia Pacific (China, Japan, India, Rest of Asia Pacific)
  • Rest of the World (Middle East & Africa, Latin America)

Access Free Sample Copy of Research Report: https://www.credenceresearch.com/sample-request/59963

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