March 29, 2020

Ball Bonder Machine Market will be growing at a CAGR of 4.04% during the forecast period from 2019 to 2027

According to a new market research report published by Credence Research “Ball Bonder Machine Market – Growth, Future Prospects and Competitive Analysis, 2019 – 2027”, the global market for ball bonder machine was valued at US$ 942.01 million in 2018 and is set to grow with a CAGR of 4.04 per cent during the forecast period 2019 to 2027.

Market Insights

The overall market for ball bonder machine is highly driven by faster ball bonding speeds of about 5-12 + wires per second. The types of wire used for this type of application include gold, palladium-coated and copper wires. Classic packages & applications for this type of process include BGA, SOP, QFP, MCM hybrid and wafer level bumping. Ball bonding process is very well suited for application of fine pitch down to 40 microns or less. With the ball bonding method, a free air ball is still being formed by an electronic flame spark underneath the capillary before the bonding begins. Free air ball after that is warped when capillary touches the surface of the bond pad & applies force & ultrasonic with the given amount of time for the purpose of deforming the ball. Thus inter-diffusion takes place between wire and bond pad metallisation, which causes intermetallic bonding.

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There has been a very high growth in the Lead / Pin count growth that has driven the increased demand for equipment for the semiconductor industry. Each I / O (Lead / Pin) must be interconnected. Ball bonding is generally used in devices below 500 I / O, advanced packaging provides additional prospects for more than 500 I / O devices. It can be estimated that 85 per cent of Semiconductor Units will be Wire Bonded by 2020. LED lead-count market demand is incremental compared to semiconductor lead-count and should be considered as distinct.

Based on the type, Fully Automatic Ball Bonder had the highest market share of more than 80 per cent in 2018, followed by the Manual Ball Bonder & Semi-Automatic Ball Bonder. In addition, continuous advancements in semiconductor packaging technologies are expected to act as a catalyst for the growth of the market for ball bonder machines. Furthermore, based on the application, IDMs have acquired the largest market share of the Ball Bonder Machine application, with a market share of more than 70% in 2018. Geographically speaking, Asia Pacific dominates the market with the highest revenue share in the world. The market is governed by China, Taiwan and Japan. The dominant position in the copper market has enabled the expansion of the market share in this region. Factors such as cost advantages and a continuously increasing number of semiconductor units are expected to further drive the APAC market.

Some of the major companies profiled in the report include Kulicke & Soffa, ASM Pacific Technology, KAIJO, SHINKAWA, F&K, Hesse, ULTRASONIC ENGINEERING, MICRO POINT PRO, Planar, West-Bond, Questar Products, TPT, PALOMAR, Mech-El Industries, Anza Technology among others.

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[Note: Our Free Complimentary Sample Report Accommodate a Brief Introduction To The Synopsis, TOC, List of Tables and Figures, Competitive Landscape and Geographic Segmentation, Innovation and Future Developments Based on Research Methodology are also Included]

Report Scope by Segments

By Type Segment

 • Manual Ball Bonder

 • Semi-Automatic Ball Bonder

 • Fully Automatic Ball Bonder

 By Application Segment

 • IDM


By Geography Segment

  • North America (U.S., Rest of North America)
  • Europe (U.K., Germany, France, Rest of Europe)
  • Asia Pacific (China, Japan, India, Rest of Asia Pacific)
  • Rest of the World (Middle East & Africa, Latin America)

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